Welcome to
Underfill|Flip chip|High precision SMD|PCBA Cleaning-Wuxi ScholMi Technology Co., Ltd.
Chinese(中文)
Add To Favorites
Home
About Us
Information
Company Values
Video
Quality
Quality Policy
Quality System
Laboratory
Manufacturing Information System
Manufacturing
Process Flow
Capability
High Precision Chip
Underfill
PCBA Cleaning
Flip Chip
BGA
Responsibility
Commitment
Employee and benefit
Join us
Recruitment
Information
Process Flow
Capability
Underfill
PCBA Cleaning
BGA
Flip Chip
High Precision Chip
Your Position:
Home
>
Process Flow
Process Flow
The figure below shows the standard process flow of our company:
keywords:
Underfill
Flip chip
High precision SMD
PCBA Cleaning